Bulletin of the Polish Academy of Sciences Technical Sciences

Editorial Board 2023-2025

Editor-in-Chief:

A. Rogalski, Military University of Technology

Honorary (Past) Editor-in Chief:

T. Kaczorek, Warsaw University of Technology

M.P. Kaźmierkowski, Warsaw University of Technology

Deputy Editor-in-Chief:

B. Błachowski, Institute of Fundamental Technological Research PAN

M. Mrozowski, Gdansk University of Technology

Board of Topical Co-editors:

Artificial and Computational Intelligence

S. Osowski, B. Sawicki and T. Leś, Warsaw University of Technology

Biomedical Engineering and Biotechnology

D. Pijanowska, Institute of Biocybernetics and Biomedical Engineering PAN

Civil Engineering

L. Czarnecki, Building Research Institute, ITB, Warsaw

Ł. Sadowski, Wroclaw University of Science and Technology

Control, Robotics and Informatics

J. Klamka and A. Babiarz, Silesian Technical University

J. Stefanowski, Poznan University of Technology

Electronics, Telecommunication and Optoelectronics

M. Mrozowski and A. Lamęcki, Gdansk University of Technology

Mechanical and Aeronautical Engineering, Thermodynamics

B. Błachowski, Institute of Fundamental Technological Research PAN

G. Zboiński, Institute of Fluid-Flow Machinery PAN and University of Warmia and Mazury in Olsztyn

Materials Science and Nanotechnology

B. Major and P. Czaja, Institute of Metallurgy and Materials Science PAN

Power Systems and Power Electronics

J. Rąbkowski and M. Jasiński, Warsaw University of Technology

International Editorial Advisory Board

R. Asthana, University of Wisconsin-Stout, Menomonie, USA

Xu Binshi, China Association of Plant Engineering, Beijing, P.R. China

F. Blaabjerg, Aalborg University, Denmark

C. Cecati, University of L’Aquila, Italy

A. Cichocki, RIKEN Institute, Tokyo, Japan

M. David, National Polytechnique de Toulouse, France

R. Ebner, Materials Centre Leoben, Leoben, Austria

E. Fornasini, University of Padova, Padova, Italy

L.G. Franquelo, University of Sevilla, Spain

M. Gad-el-Hak, Virginia Commonwealth University, Richmond, USA

M. Giersig, Free University of Berlin, Germany

D. van Gemert, Catholic University Leuven, KU Leuven, Belgium

L. Keviczky, Hungarian Academy of Sciences, Budapest, Hungary

V. Kučera, Czech Technical University in Prague, Prague, Czech Republic

R. Kennel, Technical University Munich, Germany

T.A. Kowalewski, Institute of Fundamental Technological Research PAN

E. Levi, Liverpool John Moore University, UK

G. Maier, Technical University of Milan, Milan, Italy

K.F. Man, City University of Hong Kong,

R. Maniewski, Institute of Biocybernetics and Biomedical Engineering PAN

H.A. Mang, Austrian Academy of Sciences, Vienna, Austria

H. Mihashi, Tohoku University, Aoba-ku, Sendai, Japan

S. Mindess, University of British Columbia, Vancouver, Canada

D.A. Mlynski, University of Karlsruhe, Karlsruhe, Germany

A.S. Nowak, University of Michigan, Ann Arbor, USA

K. Ohnishi, Keio University, Yokohama, Japan

A. Öberg, Linköping University, Linköping, Sweden

W. Pedrycz, University of Alberta, Canada

M. Razeghi, Northwestern University, Evanston, USA

J. Rodriguez, University of Andres Bello, Santiago, Chile

J.V. Sloten, Catholic University Leuven, Leuven, Belgium

B.M. Wilamowski, University of Auburn, Alabama, USA

A.L. Yarin, University of Illinois at Chicago, USA

Du Xiangwan, Chinese Academy of Engineering, China

J. Żurada, Department of Computer Engineering, University of Louisville, USA

Editorial Office:

Pałac Kultury i Nauki

Wydział IV Nauk Technicznych PAN

Pl. Defilad 1

PL 00-901 Warszawa

Managing Editor:

Renata Podraza, e-mail: Renata.Podraza@pan.pl

Finance:

Katarzyna Łasak, e-mail: Katarzyna.Lasak@pan.pl