Details Details PDF BIBTEX RIS Title Cu Electrodeposition on Polypyrrole Precoat for the Metallization of Printed Circuit Boards Journal title Archives of Metallurgy and Materials Yearbook 2025 Volume vol. 70 Issue No 4 Authors Junhui, Hu ; Hui, Y. ; Xiaoge, Ch. ; Chuanyun, W. Affiliation Junhui, Hu : Shanghai Institute of Technology, School of Chemical and Environmental Engineering, Shanghai, China ; Hui, Y. : Shanghai Institute of Technology, School of Chemical and Environmental Engineering, Shanghai, China ; Xiaoge, Ch. : Shanghai Institute of Technology, School of Chemical and Environmental Engineering, Shanghai, China ; Chuanyun, W. : Shanghai Institute of Technology, School of Chemical and Environmental Engineering, Shanghai, China Keywords Polypyrrole precoat ; Plastic metallization ; Printed circuit board Divisions of PAS Nauki Techniczne Coverage 1905-1912 Publisher Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences Date 22.12.2025 Type Article Identifier DOI: 10.24425/amm.2025.156277 <div class="test"></div>