TY - JOUR N2 - In this study, silicon carbide (SiC) reinforced lead-free solder (SAC305) was prepared by the powder metallurgy method. In this method SAC305 powder and SiC powder were milled, compressed and sintered to prepare composite solder. The composite solders were characterized by optical and scanning electron microscopy for the microstructural investigation and mechanical test. Addition of 1.5 wt. % and 2 wt. % ceramic reinforcement to the composite increased compressive strengths and microhardness up to 38% and 68% compared to those of the monolithic sample. In addition, the ceramic particles caused an up to 55% decrease in the wetting angle between the substrate and the composite solder and porosity was always increased with increase of SiC particles. L1 - http://www.czasopisma.pan.pl/Content/111325/PDF/AMM-2019-2-28-Manoj%20Kumar%20Pal.pdf L2 - http://www.czasopisma.pan.pl/Content/111325 PY - 2019 IS - No 2 EP - 606 DO - 10.24425/amm.2019.127585 KW - composite solder KW - SiC particles KW - microstructure KW - Wettability KW - microhardness A1 - Pal, Manoj Kumar A1 - Gergely, G. A1 - Koncz-Horvath, D. A1 - Gacsi, Z. PB - Institute of Metallurgy and Materials Science of Polish Academy of Sciences PB - Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences VL - vol. 64 DA - 2019.06.27 T1 - Influence of Ceramic Particles on the Microstructure and Mechanical Properties of SAC305 Lead-Free Soldering Material SP - 603 UR - http://www.czasopisma.pan.pl/dlibra/publication/edition/111325 T2 - Archives of Metallurgy and Materials ER -