@ARTICLE{Bąba_Sebastian_Multiparameter_2021, author={Bąba, Sebastian}, volume={69}, number={3}, journal={Bulletin of the Polish Academy of Sciences Technical Sciences}, pages={e137386}, howpublished={online}, year={2021}, abstract={The main drawback of any Design for Reliability methodology is lack of easy accessible reliability models, prepared individually for each critical component. In this paper, a reliability model for SiC power MOSFET in SOT – 227 B housing, subjected to power cycling, is presented. Discussion covers preparation of Accelerated Lifetime Test required to develop such reliability model, analysis of semiconductor degradation progress, samples post-failure analysis and identification of reliability model parameters. Such model may be further used for failure prognostics or useful lifetime estimation of High Performance Power Supplies.}, type={Article}, title={Multiparameter reliability model for SiC power MOSFET subjected to repetitive thermomechanical load}, URL={http://www.czasopisma.pan.pl/Content/119835/PDF/29_02133_Bpast.No.69(3)_24.06.21_Druk.pdf}, doi={10.24425/bpasts.2021.137386}, keywords={reliability engineering, reliability modelling, power MOSFET, SiC}, }